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W162
Spread AwareTM, Zero Delay Buffer
Features
* Spread AwareTM--designed to work with SSFTG reference signals * Two banks of four outputs, plus the fed back output * Outputs may be three-stated * Available in 16-pin SOIC or SSOP package * Extra strength output drive available (-19 version) * Internal feedback Table 1. Input Logic SEL1 0 0 1 1 SEL0 0 1 0 1 QA0:3 ThreeState Active Active Active QB0:3 ThreeState ThreeState Active Active PLL Shutdown Active, Utilized Shutdown, Bypassed Active, Utilized QFB Active Active Active Active
Key Specifications
Operating Voltage: ............................................... 3.3V10% Operating Range: ................................15 < fOUT < 133 MHz Cycle-to-Cycle Jitter: .................................................. 250 ps Output to Output Skew: ............................................. 150 ps Propagation Delay: ..................................................... 150 ps
Block Diagram
Pin Configuration
QFB REF PLL
REF
MUX QA0 QA1 QA2
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10 9
QFB QA3 QA2 VDD GND QB3 QB2 SEL0
QA0 QA1 VDD GND QB0
QA3 QB0
SEL0
QB1 SEL1
SEL1 QB1 QB2 QB3
Spread Aware is a trademark of Cypress Semiconductor Corporation.
Cypress Semiconductor Corporation Document #: 38-07150 Rev. *A
*
3901 North First Street
*
San Jose
*
CA 95134 * 408-943-2600 Revised December 14, 02
W162
Pin Definitions
Pin Name REF QFB QA0:3 QB0:3 VDD GND SEL0:1 Pin No. 1 16 2, 3, 14, 15 6, 7, 10, 11 4, 13 5, 12 9, 8 Pin Type I O O O P P I Pin Description Reference Input: The output signals QA0:3 through QB0:3 will be synchronized to this signal unless the device is programmed to bypass the PLL. Feedback Output: This signal is used as the feedback internally to establish the propagation delay of nearly 0. Outputs from Bank A: The frequency of the signals provided by these pins is equal to the signal connected to REF. Outputs from Bank B: The frequency of the signals provided by these pins is equal to the signal connected to REF. Power Connections: Connect to 3.3V. Use ferrite beads to help reduce noise for optimal jitter performance. Ground Connections: Connect all grounds to the common system ground plane. Function Select Inputs: Tie to VDD (HIGH, 1) or GND (LOW, 0) as desired per Table 1. For more details on Spread Spectrum timing technology, please see the Cypress Application note titled, "EMI Suppression Techniques with Spread Spectrum Frequency Timing Generator (SSFTG) ICs."
Overview
The W162 products are nine-output zero delay buffers. A Phase-Locked Loop (PLL) is used to take a time-varying signal and provide eight copies of that same signal out. Internal feedback is used to maximize the number of output signals provided in the 16-pin package.
Functional Description
Logic inputs provide the user the ability to turn off one or both banks of clocks when not in use, as described in Table 1. Disabling a bank of unused outputs will reduce jitter and power consumption, and will also reduce the amount of EMI generated by the W162. These same inputs allow the user to bypass the PLL entirely if so desired. When this is done, the device no longer acts as a zero delay buffer, it simply reverts to a standard nine-output clock driver.
Spread Aware
Many systems being designed now utilize a technology called Spread Spectrum Frequency Timing Generation. Cypress has been one of the pioneers of SSFTG development, and we designed this product so as not to filter off the Spread Spectrum feature of the Reference input, assuming it exists. When a zero delay buffer is not designed to pass the SS feature through, the result is a significant amount of tracking skew which may cause problems in systems requiring synchronization.
Document #: 38-07150 Rev. *A
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W162
Absolute Maximum Ratings[1]
Stresses greater than those listed in this table may cause permanent damage to the device. These represent a stress rating only. Operation of the device at these or any other conditions
.
above those specified in the operating sections of this specification is not implied. Maximum conditions for extended periods may affect reliability Rating -0.5 to +7.0 -65 to +150 0 to +70 -55 to +125 0.5 Unit V C C C W
Parameter VDD, VIN TSTG TA TB PD
Description Voltage on any pin with respect to GND Storage Temperature Operating Temperature Ambient Temperature under Bias Power Dissipation
DC Electrical Characteristics: TA =0C to 70C, VDD = 3.3V 10%
Parameter IDD VIL VIH VOL VOH IIL IIH Description Supply Current Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage Input Low Current Input High Current IOL = 12 mA (-19) IOL = 8 mA (-9) IOL = 12 mA (-19) IOL = 8 mA (-9) VIN = 0V VIN = VDD 2.4 -500 10 2.0 0.4 Test Condition Unloaded, 100 MHz Min Typ Max 40 0.8 Unit mA V V V V A A
AC Electrical Characteristics: TA = 0C to +70C, VDD = 3.3V 10%
Parameter fIN fOUT tR tF tPD tSK tD tLOCK tJC Description Input Frequency Output Frequency Output Rise Time (-09) Output Rise Time (-19) Output Fall Time (-09) Output Rise Time
[2] [2]
Test Condition
[6]
Min 15
Typ
Max 133 133
Unit MHz MHz ns ns ns ns ps ps % ms ps
15-pF load
15 2
2.0 to 0.8V, 15-pF load 2.0 to 0.8V, 20-pF load 2.0 to 0.8V, 15-pF load 2.0 to 0.8V, 20-pF load Measured at VDD/2 All outputs loaded equally 15-pF load
[5]
2.5 1.5
[2]
2
2.5 1.5 150 150
(-19)[2]
[3, 4]
FBIN to REF Skew
Output to Output Skew Duty Cycle PLL Lock Time Jitter, Cycle-to-Cycle
45
50
55 1.0 250
Power supply stable
Notes: 1. Multiple Supplies: The voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required. 2. Long input rise and fall time will degrade skew and jitter performance. 3. All AC specifications are measured with a 50 transmission line, load terminated with 50 to 1.4V. 4. Skew is measured at VDD/2 on rising edges. 5. Duty cycle is measured at VDD/2 6. For the higher drive -19, the load is 20 pF.
Document #: 38-07150 Rev. *A
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W162
Schematic
1 2 Ferrite Bead 3 4 16 15 14 13 12 11 10 9 VDD or GND (for desired operation mode) Ferrite Bead
Ref In Output Output Power Ground Output Output Logic In
Output Output Output Power Ground Output Output Logic In
VDD
10 F 0.1F
5 6 7
0.1 F10F
VDD
VDD or GND (for desired operation mode)
8
Ordering Information
Ordering Code W162 Option -09, -19 Package Name G H Package Type 16-pin Plastic SOIC (150-mil) 16-pin Plastic SSOP (150-mil)
Document #: 38-07150 Rev. *A
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W162
Package Diagrams
16-pin SSOP Small Shrunk Outline Package (SSOP, 150-mil)
Document #: 38-07150 Rev. *A
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W162
Package Diagrams (continued)
16-Pin Small Outlined Integrated Circuit (SOIC, 150-mil)
Document #: 38-07150 Rev. *A
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(c) Cypress Semiconductor Corporation, 2001. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
W162
Document Title: W162 Spread AwareTM. Zero Delay Buffer Document Number: 38-07150 REV. ** *A ECN NO. 110590 122799 Issue Date 12/19/01 12/14/02 Orig. of Change DSG RBI Description of Change Change from Spec number: 38-00788 to 38-07150 Add Power up Requirements to Operating Conditions Information
Document #: 38-07150 Rev. *A
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